1. Device for aligning a wafer on a wafer carrier

2. Wafer carrier

3. Close, but no wafer.

4. The Pyra system’s heating capability for soak Anneals is based on a resistive heater that delivers excellent within-wafer and wafer-to-wafer anneal uniformity

5. Pharmaceutical wafer, gelatin-starch films

6. A double-wafer out of season.

7. Wafer bonding activated by ion implantation

8. Then roll dough to wafer thickness.

9. Wafer carrier with stacking adaptor plate

10. Wafer Bumping can be considered as a step in wafer processing where solder spheres are attached to the chip I/O pads before the wafer is diced into individual chips

11. Composite material composition for a wafer carrier

12. Now people can produce a wafer silicon.

13. Wafer and method of forming alignment markers

14. A K alpha radiation emitting wafer (e.g., Pb) wafer is disposed between the radiation transparent tip and the radiation detector.

15. The Aneroid wafer is just a metal balloon

16. One computer-implemented method for detecting defects on a wafer includes acquiring output for the wafer generated by an inspection system.

17. A wafer polishing solution and method for polishing a wafer comprising an amino acid and calcium ions or barium ions.

18. Would you like to know who ate the wafer?

19. Solder Bumping and Wafer Level Chip Scale Packaging

20. Semiconductor wafer immersion systems and treatments using modulated acoustic energy

21. One computer-implemented method for identifying defect types on a wafer includes acquiring output of an inspection system for defects detected on a wafer.

22. Perfect for use with the LatticeAx™ Wafer Cleaving System

23. Primary Orientation Flat - The longest flat found on the wafer.

24. The invention provides a polycrystalline silicon wafer texturizing additive.

25. 15 Hitachi has developed a wafer-scale neural network.

26. Adapter for inserting wafer ring between flanges of process piping

27. Wafer machining adhesive tape, and its manufacturing method and using method

28. DIE Attachers Multichip bonder Wafer handler Dispenser Dual H PCBC

29. Provided is a cleaning apparatus for cleaning a polished semiconductor wafer.

30. Semiconductor wafer surface protecting semi-adhesive film and production method for same

31. A method for wafer bonding two substrates activated by ion implantation is disclosed.

32. The Pope then brought out a communion wafer and a chalice of wine.

33. They are made from wafer biscuits and cost ￡80 for a box of

34. The resulting measurements are fed into a computer algorithm that calculates the dynamic scanning field curvature in an absolute sense in the presence of wafer height variation and other wafer/reticle stage irregularities.

35. MOLECULAR AIRBORNE CONTAMINANTS (MACs) REMOVAL AND WAFER SURFACE SUSTAINING SYSTEM AND METHOD

36. Cleaving Kit: The complete tool set to get from wafer to cleanly cleaved pieces

37. It may also mean: Clodhopper candies — a type of fudge-covered graham wafer

38. The Benne Seed Wafer is a thin cookie, made with tasty toasted sesame

39. Using a sharp knife, cut the Bresaola into wafer-thin slices to serve

40. Wafer probe station capable of actively controlling tilt of chuck and controlling method thereof

41. Laser Light - Scattering Event - A signal pulse that locates surface imperfections on a wafer.

42. A timing calibration system for a wafer level integrated circuit (IC) tester is disclosed.

43. The broad term “wafer Bumping” will be defined in this article as the process by which solder, in the form of bumps or balls, is applied to the device at the wafer level.

44. The kit includes wafer mat, scribes for marking and scribing, pliers for Cleaving, rulers and instructions

45. Christmas BUCHE - CHRISTMAS LOG - Macarons- 24 discs Azyme 3.5 cm-wafer 24 edible disks 1.40"

46. Single wafer, multi-chamber process platform for cassette-to-cassette cleaning, etching, developing and electroplating (ECD).

47. A 300-year-old recipe, we've been baking our Benne Wafer cookies since 1954

48. The wafer was in his mouth and the sweet wine, but he wanted more.

49. The Australian Chomp consists of a layer of wafer and caramel, coated in compound chocolate.

50. Semiconductor wafer suitable for forming a semiconductor junction diode device and method of forming same

51. Micross AIT provides full in-house state-of-the-art wafer Bumping and WLCSP solutions

52. Fish vertically, lifting and shaking the jig to make the wafer-thin Bloodworm tail come alive

53. The bake plate (110) is positioned within the oven and adapted to receive the wafer (115).

54. The parts of the wafer (1) on the second areas are etched in the second trench etching.

55. Next, the wafer is realigned in the stepper using the error-free fine alignment target.

56. The composition is alkaline, which can remove azole-type corrosion inhibitors on the wafer surface after CMP.

57. The wafer is held in position by a tooling head and is contacted by an abrasive pad.

58. Each Brooder comes with a thermometer and a wafer thermostat, which is accurate to 1 degree

59. Evidence of micro-Arcing can also be identified when performing on-wafer analysis of particle contamination

60. Shown here is a photomask, which bears the patterns that will be printed onto a wafer.

61. FRP wafer board technology is adopted as penetration in clean room of electron chip production base.

62. In one project, cadavers, that's dead bodies, were frozen and sliced into thousands of wafer- thin discs.

63. The Battue is a wafer-thin, flat target which can be presented as loopers, crossing or quartering targets

64. For etch processes, a separate powered electrode may be used to accelerate ions toward a wafer surface.

65. The adaptor plate (50) will ideally have a cooperating machine interface portions to allow stacking of the wafer carriers.

66. In another step a first pattern, including an error-free fine alignment target, is created on the wafer.

67. Wafer Bumping is replacing wire bonding as the interconnection of choice for a growing number of components

68. In another step, the wafer is aligned in the stepper using the error-free fine alignment target.

69. In addition, thanks to adjustments in processing and handling procedures, the wafer breakage rate is only 4.5 %.

70. During the process, we coat SU-8 50 on a silicon wafer with a thickness of about 100ųm.

71. This, flanked by the contents of two tins of Spam, equally wafer-like, drew cries of greedy amazement.

72. Further growth of continuous compound semiconductor thick films or wafer is achieved by epitaxial lateral overgrowth using HVPE.

73. The movement means (23) are designed as circulating belts (24), with a suction surface (25) against which the uppermost wafer (12) is made to abut, wherein the abutment of the wafer (12) against the suction surface (25) is enhanced by negative pressure or suction.

74. A sheet wafer growth system includes a crucible for containing molten material and an afterheater positioned above the crucible.

75. The Annealsys model AS-Master is a single wafer rapid thermal process system supports anneal processing in the NanoFab cleanroom

76. Semiconductor companies owned and operated their own silicon-wafer fabrication facilities and developed their own process technology for manufacturing their chips.

77. The afterheater and the shield(s) are configured to allow a sheet wafer to pass adjacent to the shield(s).

78. CNC machined from a wafer thin strip of ultralight aluminum, the Iain Sinclair Cardsharp4 Knife has ultimate robustness and strength

79. Diesire Edgeables - Countesses Crown Die Size: 5.2 x 1.9 Wafer-thin metal dies are easy to storeFor cardmaking, scrapbooking and more

80. Semiconductor manufacturing for gallium Arsenide devices includes four main operations: (1) ingot growing, (2) wafer processing, (3) epitaxy, and (4) device fabrication