1. A photoresist coater

2. Photoresist stripper/cleaner compositions containing aromatic acid inhibitors

3. It is used as a basic solvent in the development of acidic photoresist in the photolithography process, and is highly effective in stripping photoresist.

4. STRIPPING OF THE PHOTORESIST IN THE UNLOAD-LOCK SHOULD BE CONSIDERED AS AN OPTION .

5. rolling or pouring machines for applying photoresist, bonding agent or adhesive to the sheets of insulating material.

6. rolling or pouring machines for applying photoresist, bonding agent or adhesive to the sheets of insulating material;

7. An alkali-soluble resin, a preparation method therefor, and a photoresist compound containing said resin.

8. Some examples include aerial images that represent expected patterns projected by a lithography system on a substrate as well as photoresist images that represent expected resist patterns.

9. A silicon-oxynitride layer is etched using a photoresist layer, and the resulting etched SixOyNz layer is used to etch an amorphous carbon layer.

10. A positive working photosensitive composition suitable for use as a photoresist, which comprises an admixture of at least one water insoluble, aqueous alkali soluble, film forming novolak resin; at least one o-diazonaphthoquinone photosensitizer; and a photoresist solvent mixture comprising a propylene glycol alkyl ether acetate and 3-methyl-3-methoxy butanol and process for producing such a composition.

11. A terpolymer with chemically amplified (acid labile) moieties and organosilicon moieties suitable for use as the binder resin for a photoimageable resist photoresist composition suitable for use in 193 nm photolithographic processes.

12. Heat-resistant negative photoresist compositions which comprise a polyamic acid and a photosensitizer consisting of a specific 1,4-dihydropyridine derivative and which are not only excellent in both sensitivity and resolution but also easily developable with aqueous alkali.