adhesive film in Vietnamese
@Chuyên ngành kỹ thuật
-màng keo
@Lĩnh vực: xây dựng
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Sentence patterns related to "adhesive film"
1. Resin composition for an adhesive film, and adhesive film using same
2. Remineralising dental adhesive film
3. Adhesive film for semiconductor
4. Adhesive film having resilient properties
5. Adhesive film for a semiconductor package
6. Biodegradable adhesive film for vascular closure
7. Highly refractive adhesive film and touch panel including same
8. Adhesive composition for semiconductor, and adhesive film comprising same
9. Adhesive film for a touch panel, and touch panel
10. Finally, an adhesive film (9) with an adhesive power
11. Optical adhesive film having excellent peeling effect at high temperatures
12. Controlled cure adhesive film comprising silane and acid grafted polymers
13. Adhesive film for a reflective sheet, and reflective sheet using same
14. Adhesive film and method for producing organic electronic device using same
15. Adhesive composition for a touch panel, adhesive film, and touch panel
16. Resin composition comprising polyalkylene carbonate and self-adhesive film produced therefrom
17. Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device
18. Semiconductor wafer surface protecting semi-adhesive film and production method for same
19. Adhesive composition, adhesive film, and method for manufacturing organic electronic device using same
20. The present invention relates to an adhesive film and to a touch panel.
21. Adhesive film having a phase difference, method for manufacturing same, and optical member including same
22. The adhesive film can include a first adhesive layer, such as and a fluoropolymer layer.
23. Flux activator, adhesive resin composition, adhesive paste, adhesive film, semiconductor device fabrication method, and semiconductor device
24. Hot melt adhesive film materials manufacturers and Apertured film factory, Pinghu Zhanpeng Hot Melt Adhesive Web & Film Co., Ltd
25. In addition, according to the present invention, an adhesive film having superior durability, optical characteristics, cuttability, workability, wettability and resistance to warping is provided.
26. The present invention relates to an adhesive film and a method for manufacturing an organic electronic device using same, and provides the adhesive film capable of effectively blocking moisture or oxygen introduced into the organic electronic device from the outside, having reliability in extreme conditions such as under high temperature and high humidity, and achieving excellent optical characteristics.
27. The EMI shielding adhesive film according to the present invention has excellent adhesive strength to electronic components, heat resistance, electrical conductivity, flexibility, chemical resistance, and flame retardancy.
28. In the adhesive film, an adhesive layer (2) for dicing a wafer and an adhesive layer (3) for die bonding are successively stacked on a base film (1).
29. The present invention relates to a non-curable rubber-based adhesive composition for a touch screen panel, containing styrene-isoprene-styrene (SIS) rubber, and a non-curable rubber-based adhesive film for a touch screen panel, using the same.
30. In particular, the EMI shielding adhesive film can be reliably applied to one or both sides of a FPCB where high flexibility, high adhesive strength, high heat resistance, and the like are required, and can effectively attenuate various kinds of electromagnetic waves generated in circuit boards.
31. The adhesive film having a phase difference exhibits minimal entangling and retains an elongated structure under high temperatures and humidity so as to provide an optical member that has decreased light leakage, retains superior durability, reworkability, and adhesion, and has an excellent balance of physical properties.
32. Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 μm or more and an adhesive part of acrylic tape of a thickness of 5 μm or more, for the protection of the surface of silicon discs (4)
33. Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 μm or more and an adhesive part of acrylic tape of a thickness of 5 μm or more, for the protection of the surface of silicon discs (1)
34. The adhesive film for a reflective sheet according to the present invention is formed by applying an adhesive composition onto the plastic base film with controlled thermal shrinkage, has superior dimensional stability and processability for reflective processing, prevents the adhesive layer from being partially detached during release, and achieves stable physical properties.
35. Transparent poly(ethylene) self-adhesive film, free from impurities or faults, coated on one side with an acrylic pressure sensitive adhesive, with a thickness of 60 μm or more, but not more than 70 μm, and with a width of more than 1 245 mm but not more than 1 255 mm
36. ex 3919 90 00 | 33 | Transparent poly(ethylene) self-adhesive film, free from impurities or faults, coated on one side with an acrylic pressure sensitive adhesive, with a thickness of 60 μm or more, but not more than 70 μm, and with a width of more than 1 245 mm but not more than 1 255 mm | 0 % | 31.12.2013 |
37. Solar panel, especially for a railway vehicle (1), comprising a flexible photovoltaic film (4) and, on one side of the photovoltaic film, an adhesive film (5) for fastening the photovoltaic film (4) to the roof (2) of the vehicle (1), which panel is characterized in that it includes on the other side of the photovoltaic film, a self-cleaning film (6) transparent to ultraviolet rays.
38. The present invention relates to an adhesive composition and film for preparing a semiconductor, and more specifically, an adhesive composition for preparing a semiconductor which comprises an acrylic resin containing acrylonitrile, a mixture of an epoxy compound and a phenolic resin, and a filler, having excellent wafer pick-up characteristics during a semiconductor manufacturing process, and has excellent adhesive strength to a wafer, a lead frame and a PCB substrate, and an adhesive film for preparing a semiconductor, containing a coating layer of the composition.